My research is related to heat transfer and flow field within micro-scale heat sinks. The microchannels have a high surface to volume ratio and therefore have attracted great attention in cooling of microelectronic devices. These heat sinks can handle the heat dissipation rate as high as 50-200 W/cm2 while the temperature of the electronic device is kept in the safe operating range. The penalty usually paid to gain higher heat transfer coefficient is large pressure drop occurring in micro-scale devices. Computational Fluid Dynamics along with experimental studies can open new paths to design efficient heat sinks while managing the high heat dissipation rate using less pumping power.